Validation of multiscale 3D chiplet stack thermal model with temperature-dependent materials through 3w measurements

Research Area
Semiconductor Technology
RPI Principal Investigators
Jacob Merson, Max Bloomfield
IBM Principal Investigators
Roy Yu, Timothy Chainer, Prabudhya Roy Chowdhury, Aakrati Jain, Mukta Farooq
Project Year
2025
IBM RPI
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