Validation of multiscale 3D chiplet stack thermal model with temperature-dependent materials through 3w measurements

Research Area
Semiconductor Technology
RPI Principal Investigators
Jacob Merson, Theodorian Borca-Tasciuc, Max Bloomfield
IBM Principal Investigators
Prabudhya Roy Chowdhury, Aakrati Jain
Project Year
2025
IBM and Rensselaer
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