Anisotropic Thermal Resistance Characterization of SI, BEOL, and underfill layers using 3 omega Joule heating thermometry and exploratory non-destructive scanning Thermal Microscopy/ Multiscale Thermal Modeling of 3D ICs

Research Area
Semiconductor Technology
RPI Principal Investigators
Theo Borca-Tasciuc, Jacob Merson, Max Bloomfield
IBM Principal Investigators
Roy Yu, Timothy Chainer, Prabudhya Roy Chowdhury, Aakrati Jain, Mukta Farooq
Project Year
2024
IBM and Rensselaer
Back to top