Molecularly engineered liner/low-k interfaces and linerless Cu interconnects Read more about Molecularly engineered liner/low-k interfaces and linerless Cu interconnects
High-Resolution X-ray Imaging for 3D-HI Chiplet Non-Destructive Internal Metal Joints Inspection Read more about High-Resolution X-ray Imaging for 3D-HI Chiplet Non-Destructive Internal Metal Joints Inspection
New materials for high-conductivity interconnects Read more about New materials for high-conductivity interconnects
Discovering topological materials for BEOL interconnects using first-principles calculations and machine learning Read more about Discovering topological materials for BEOL interconnects using first-principles calculations and machine learning
Glancing electron diffraction study of Cu pads surface texture for hybrid bonding Read more about Glancing electron diffraction study of Cu pads surface texture for hybrid bonding
Integrated Sensing and Communication with AI-RAN Platform Read more about Integrated Sensing and Communication with AI-RAN Platform
Rethinking Retrieval Signals via Hybrid Retrieval Heads Read more about Rethinking Retrieval Signals via Hybrid Retrieval Heads
KV-cache Management for Improving Run-time efficiency of Large Reasoning Models Read more about KV-cache Management for Improving Run-time efficiency of Large Reasoning Models
Hardware–Software Co-Design of Efficient Spatiotemporal Transformers and Mixture-of-Experts on IBM Hardware Read more about Hardware–Software Co-Design of Efficient Spatiotemporal Transformers and Mixture-of-Experts on IBM Hardware
Exploring Analog-Aware Learning and Architectures with Hardware Support for Next-Generation Foundation Models Read more about Exploring Analog-Aware Learning and Architectures with Hardware Support for Next-Generation Foundation Models
